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Dive deeper into Reference Design 121 with its Engineering Package

10.4 MW Greenfield / 6.2 MW Retrofit — Tier III, ANSI, Chilled Water, Liquid-Cooled AI Clusters for AMD Instinct™ MI455X GPUs
As AI workloads push rack densities beyond traditional limits, infrastructure teams need validated designs that reduce deployment risk and accelerate planning. Reference Design 121 provides a proven blueprint for deploying AMD Helios Rackscale Solutions powered by AMD Instinct™ MI455X GPUs, supporting rack densities up to 246 kW per rack with a resilient, concurrently maintainable Tier III architecture. The design has been evaluated for both greenfield and retrofit deployment scenarios. Covers four critical infrastructure domains: Facility Power · Facility Cooling · IT Space · Lifecycle Software

The engineering package includes:

Facility layout drawings
Electrical single-line diagrams
Mechanical piping drawings
Power, cooling, and IT equipment lists
Greenfield and retrofit ETAP power system models
Greenfield and retrofit CFD analysis packages

Why Download?

Whether you're planning a new AI facility or assessing an existing data center for AI readiness, this engineering package provides practical design guidance to help you:

Evaluate infrastructure requirements for liquid-cooled AI clusters
Review validated power and cooling architectures
Analyze electrical system performance using ETAP models
Assess thermal performance through CFD analysis
Accelerate engineering and design decisions with a proven reference architecture

Download Your Engineering Package Now
Documentation is available in multiple formats to suit the needs of both engineers and managers working on data center projects. To access the engineering package for this design, please fill out this form.